The SmartCut™ technology is widely used in microelectronics for the fabrication of innovative substrates, such as SOI (Silicon-on-Insulator).
The physical phenomena underlying SmartCut™ technology remain one of principal interest of our research. Optimizing the fracture stage is a major focus in our laboratory and in our collaboration with Soitec. Salomon's PhD thesis (expected completion December 2026), the development of post-fracture surface analysis protocols highlighted the link between the evolution of cristalline defects that cause fracture (platelets) and post-fracture surface roughness. We were thus able to characterize the early stages of platelet growth and determine their main characteristics (size and density). This had previously only been achieved through complex characterizations based on TEM observations.

Now that we have highlighted the impact of platelets on post-fracture surface roughness, the next step is to investigate and identify ways to control their nucleation using new processes. This will also involve optimizing the post-fracture state of SOI substrates.